Multilayer ceramic substrate with graded vias

Details Multilayer ceramic substrate with graded vias Multilayer ceramic substrate with graded vias

1992-09-23

1993-11-09

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 174264, H05K 100

Patent

active

052605191

ABSTRACT:
Disclosed is a multilayer ceramic substrate for electronic applications including:

REFERENCES:
patent: 4234367 (1990-11-01), Herron et al.
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4594181 (1986-06-01), Siuta
patent: 5029242 (1991-07-01), Sammet
patent: 5073180 (1991-12-01), Farooq et al.
IBM patent application, Ser. No. 07/758,991, Filed Sep. 10, 1991, F. Y. Aoude et al., "Copper-Based Paste Containing Copper Aluminate For Microstructural and Shrinkage Control of Copper-Filled Vias".

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