Multilayer ceramic substrate with circuit patterns

Details Multilayer ceramic substrate with circuit patterns Multilayer ceramic substrate with circuit patterns

1987-05-08

1989-01-03

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428432, 428617, 428618, 428673, 428901, 174 685, 361414, B32B 700, H05K 100

Patent

active

047956704

ABSTRACT:
A multilayer ceramic substrate with multilayered circuit patterns, the improvement in which internal conductors for wiring are formed by a Ag base conductive materials capable of being co-fired with multilayered green ceramic substrate sheets in an oxidizing atmosphere and external conductors electrically connected with the internal conductors are formed by a Cu base conductive material, the external Cu conductors being formed in such a manner so that a liquid phase of Cu-Ag is not formed at the interface of the Cu conductor and the Ag conductor. Further high reliable resistors of RuO.sub.2 or Bi.sub.2 Ru.sub.2 O.sub.7 type may be integrally formed onto and/or inside the substrate. In such an arrangement, problems or difficulties caused due to Ag migration, incomplete binder removal, solder leaching, etc., are eliminated and thereby there can be a multilayer substrate with a high reliability and a high pattern precision.

REFERENCES:
patent: 3031344 (1963-04-01), Sher et al.
patent: 4299873 (1981-11-01), Ogihara et al.
patent: 4313026 (1986-01-01), Yamada et al.
patent: 4328531 (1982-05-01), Nagashima et al.
patent: 4459166 (1984-07-01), Dietz et al.
patent: 4465742 (1984-08-01), Nagashima et al.
patent: 4620264 (1986-10-01), Ushifusa et al.
patent: 4650923 (1987-03-01), Nishigaki et al.
patent: 4663215 (1987-05-01), Dubuisson et al.
patent: 4665468 (1987-05-01), Dohya
patent: 4672152 (1987-06-01), Shinohara et al.
patent: 4675788 (1987-06-01), Breitling et al.
patent: 4732798 (1988-03-01), Ishida et al.

Affiliated with

Also associated with

Rating

Multilayer ceramic substrate with circuit patterns does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer ceramic substrate with circuit patterns, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer ceramic substrate with circuit patterns will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2167810