Multilayer ceramic substrate structure

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

29625, 264 61, 264 62, 264131, 427 96, 427 97, H05K 104, H05K 114

Patent

active

039990044

ABSTRACT:
This is a microelectronic multilayer circuit structure having circuit compatibility encapsulated within the circuit package including conductive electrical interconnection means formed by uniquely metallizing the "via" and/or blind interconnection holes within the circuit package. The assembly process provides means of uniformly metallizing the interlayer connecting holes.

REFERENCES:
patent: 3661638 (1972-05-01), Lemecha
patent: 3699919 (1972-10-01), Coffman
patent: 3770529 (1973-11-01), Anderson
patent: 3852877 (1974-12-01), Ahn

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