Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-07-20
1989-01-24
Robinson, Ellis P.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
428209, 428210, 428437, 428524, 264 58, 264 62, C04B 3702, C04B 3302
Patent
active
047999837
ABSTRACT:
A process for forming a multi-layer ceramic substrate. The process includes the steps of obtaining a plurality of ceramic sheets in the green state, depositing a conductive metal pattern on at least one of the green ceramic sheets, heating the at least one green ceramic sheet so as to soften it, pressing the conductive metal pattern into the at least one green ceramic sheet, stacking and laminating the green ceramic sheets so as to form a substrate and then sintering the substrate. There is also disclosed a multi-layer ceramic substrate having a conductive metal pattern pressed into the at least one green ceramic sheet.
REFERENCES:
patent: 3247573 (1966-04-01), Noack
patent: 3423517 (1969-01-01), Arrhenius
patent: 3723176 (1973-03-01), Theobald et al.
patent: 3800020 (1974-03-01), Parfet
patent: 3882059 (1975-05-01), Elderbaum
patent: 4020234 (1977-04-01), Gardner
patent: 4346516 (1982-08-01), Yokouchi et al.
patent: 4510000 (1985-04-01), Kumar
patent: 4552615 (1985-11-01), Amendola
patent: 4572754 (1986-02-01), Bloom
patent: 4586972 (1986-05-01), Yokotani et al.
patent: 4614837 (1986-09-01), Kane et al.
patent: 4649125 (1987-03-01), Takeuchi et al.
patent: 4672152 (1987-06-01), Shinohara
patent: 4696851 (1987-09-01), Pryor
Acosta et al., "Planarization of Copper Circuits for Multilevel Ceramic Package", IBM Technical Disclosure Bulletin, vol. 26, No. 10B, 5378 (Mar. 1984).
Desai et al., "Screen Printing on Indented Ceramic Green Sheets", IBM Technical Disclosurre Bulletin, vol. 16, No. 11, 3561 (Apr. 1974).
Desai et al., "Adhesion Promotion to Green Ceramic Sheets", IBM Technical Disclosure Bulletin, vol. 16, No. 11, 3563 (Apr. 1974).
Blecker Ira David
International Business Machines - Corporation
Loney Donald J.
Robinson Ellis P.
LandOfFree
Multilayer ceramic substrate and process for forming therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer ceramic substrate and process for forming therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer ceramic substrate and process for forming therefor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-418354