Multilayer ceramic substrate and method for manufacturing...

Details Multilayer ceramic substrate and method for manufacturing... Multilayer ceramic substrate and method for manufacturing...

2011-03-22

2011-03-22

Lam, Cathy (Department: 1784)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S762000, C361S763000, C361S764000, C174S258000, C174S535000, C174S541000, C428S210000, C428S212000, C501S016000, C501S120000

Reexamination Certificate

active

07911801

ABSTRACT:
A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer includes a second powder including a second ceramic material that will not be sintered at a temperature for melting the glass material, and is in such a state that the second powder adheres together by diffusion or flow of a portion of the first powder including the glass material included in the base material layer at the time of baking. The incorporated element is in such a state that an entire periphery thereof is covered with the interlayer constraining layer.

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Official Communication issued in International Patent Application No. PCT/JP2008/062574, mailed on Aug. 12, 2008.

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