Multilayer ceramic substrate

Details Multilayer ceramic substrate Multilayer ceramic substrate

2009-05-18

2011-11-08

Lam, Cathy (Department: 1784)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S257000, C174S265000, C257S775000, C428S210000

Reexamination Certificate

active

08053682

ABSTRACT:
There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.

REFERENCES:
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 5028473 (1991-07-01), Vitriol et al.
patent: 5139851 (1992-08-01), Acocella et al.
patent: 5340947 (1994-08-01), Credle et al.
patent: 5450290 (1995-09-01), Boyko et al.
patent: 5496619 (1996-03-01), Itagaki et al.
patent: 5576518 (1996-11-01), Shibuya et al.
patent: 5717247 (1998-02-01), Koh et al.
patent: 5855711 (1999-01-01), Araki et al.
patent: 6645607 (2003-11-01), Curcio et al.
patent: 6790305 (2004-09-01), Curcio et al.
patent: 7084350 (2006-08-01), De La Prieta et al.
patent: 7749592 (2010-07-01), Nakamura et al.
patent: 2006/0000641 (2006-01-01), Salama et al.
patent: 2004-288915 (2004-10-01), None
patent: 10-2005-0036367 (2005-04-01), None
patent: 10-2005-0091177 (2005-09-01), None
patent: 10-2006-0070930 (2006-06-01), None
Korean Office Action, with English translation, issued in Korean Patent Application No. 10-2008-0084726, mailed May 11, 2010.

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