Multilayer ceramic package with low-variance embedded resistors

Details Multilayer ceramic package with low-variance embedded resistors Multilayer ceramic package with low-variance embedded resistors

1997-05-28

2000-08-08

Luebke, Renee S.

Electrical resistors

Element in layers piled or stacked between terminals

338310, 338320, H01C 718

Patent

active

061007870

ABSTRACT:
A multilayer electronic component (200) is provided. The component includes a substrate package assembly (202) with a set of stacked insulated sheets of a dielectric ceramic material (204, 206, 208, 210, 212). Also included are a set of embedded resistors (214), each of the embedded resistors including an electrical input port pad (216) and an electrical output port pad (218) provided in layers between the set of stacked insulated sheets. Each of the insulated sheets has a trough (220) of a predetermined length aligned between and transverse to the electrical input port pad (216) and the electrical output port pad (218). The trough (220) reduces the resistance value variability in the multilayer electronic component (200). The trough (220) is substantially filled with a resistive paste material and an internal circuit (222) connects the embedded resistors inside the substrate package assembly (202). A method of forming the substrate package assembly (202) is also provided.

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