Multilayer ceramic package with center ground via for size reduc

Details Multilayer ceramic package with center ground via for size reduc Multilayer ceramic package with center ground via for size reduc

1997-11-05

1999-11-02

Pascal, Robert

Wave transmission lines and networks

Long lines

Strip type

333162, 333204, 336200, H01P 308, H01P 1203, H01F 2700

Patent

active

059778504

ABSTRACT:
A multilayer ceramic package 200 with a center ground via 202 for size reduction is disclosed. Package 200 includes dielectric layers 204A-204G each having a major surface 206. The package also includes an input electrode 208 and an output electrode 210 as well as a top ground plane 212 and a bottom ground plane 214. Package 200 includes a substantially spiral transmission line structure made from electrodes 216. Package 200 also includes a ground via 202 extending vertically through the plurality of dielectric layers 204A-204G. The center ground via 202 is substantially centered inside the substantially spiral transmission line structure and electrically isolated therefrom and connected to the top ground plane 212 and the bottom ground plane 214.

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