Multilayer ceramic electronic component manufacturing method...

Details Multilayer ceramic electronic component manufacturing method... Multilayer ceramic electronic component manufacturing method...

2006-03-21

2006-03-21

Brewster, William M. (Department: 2823)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089120, C156S089160

Reexamination Certificate

active

07014725

ABSTRACT:
A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer includes a thermoplastic resin and at least one of Cr, Mg, Al, Si, a Cr compound, an Mg compound, an Al compound, an Si compound and an inorganic powder included in the ceramic sheet. This manufacturing method improves adhesion between a ceramic layer and the internal electrode after sintering and suppresses a structural defect such as delamination or a crack.

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