Multilayer ceramic electronic component and mounting...

Details Multilayer ceramic electronic component and mounting... Multilayer ceramic electronic component and mounting...

2005-06-07

2005-06-07

Dinkins, Anthony (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S301300, C361S306300, C029S025410, C029S025420

Reexamination Certificate

active

06903919

ABSTRACT:
A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.

REFERENCES:
patent: 6370015 (2002-04-01), Noda et al.
patent: 6381117 (2002-04-01), Nakagawa et al.
patent: 6519132 (2003-02-01), Liu

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