Multilayer ceramic circuit board

Details Multilayer ceramic circuit board Multilayer ceramic circuit board

1993-03-01

1995-01-24

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174257, 174259, 361761, 361762, 361763, 361766, H05K 100

Patent

active

053844343

ABSTRACT:
A dielectric substrate element of a multilayer structure provided with a capacitor in its interior and a magnetic substrate element of a multilayer structure provided with an inductor in its interior are prepared independently of each other. These substrate elements are respectively fired, then superposed with each other, and electrically connected and mechanically bonded by solder bumps to be integrated with each other. Thus, it is possible to obtain a multilayer ceramic circuit board with no integral firing, and the materials for the dielectric substrate element and the magnetic substrate element are not restricted in their capability of integral firing.

REFERENCES:
patent: 4424615 (1984-01-01), Wakino
patent: 4574329 (1986-03-01), Eijkelenkemp et al.
patent: 4613918 (1986-09-01), Kanai et al.
patent: 4706162 (1987-11-01), Hernandez et al.
patent: 4956114 (1990-09-01), Watanabe et al.
patent: 5113300 (1992-05-01), Ikeda et al.
patent: 5119266 (1992-06-01), Petry
patent: 5165984 (1992-11-01), Schoenthaler
patent: 5177670 (1993-01-01), Shinohara et al.

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