Multilayer ceramic chip capacitor and a process for its manufact

Details Multilayer ceramic chip capacitor and a process for its manufact Multilayer ceramic chip capacitor and a process for its manufact

1996-04-15

1998-01-27

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361311, 361313, 3613213, 3613214, 3613063, 3613081, H01G 406

Patent

active

057127581

ABSTRACT:
The multilayer ceramic chip capacitor includes a multilayer ceramic capacitor chip having internal electrodes and an external electrode that is formed of a sintered layer of a paste containing both an electroconductive metal powder and a glass frit on both end faces of the multilayer ceramic capacitor chip and having an electric connection to the internal electrodes. A coating of plated metal is deposited on the surface of the external electrode. The multilayer ceramic capacitor chip is chamfered to a radius of curvature (R) of 0.10 mm or more on the periphery of each of the end faces at which the internal electrodes are to be connected to the external electrode and/or the external electrode has a dual structure consisting of an undercoat in contact with the internal electrodes and a topcoat in superposition on the surface of the undercoat. The undercoat is being formed of a paste containing unmolten glass frit in an amount from 22 to 40 wt % of the electroconductive metal powder and the topcoat is formed of a paste containing unmolten glass frit in an amount from more than 0 to 7 wt % of the electroconductive metal powder. Both the topcoat and the undercoat are formed by sintering the applied pastes at temperatures that cause only the surfaces of the particles in the glass frit to melt. This capacitor and other types of ceramic multilayer chip electronic components manufactured by this inventive process have high resistance to cyclic thermal impacts.

REFERENCES:
patent: 4819128 (1989-04-01), Florian et al.
patent: 4956744 (1990-09-01), Berghout et al.

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