Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1987-11-13
1989-08-29
Bell, James J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428284, 4284744, 4284749, 428 352, 428 354, B32B 2934
Patent
active
048616540
ABSTRACT:
The invention is concerned with a multilayer carrier film for supporting a fluid synthetic resin composition impregnated fibrous mat against a surface, for example the inside surface of a pipe, during the curing of the resin. The film comprises a nylon layer (preferably nylon 6) having on one surface a layer of a polyamide copolymer having a softening point at a temperature below 170.degree. C. (for example a nylon 6/12 copolymer in which the nylon 12 component lies in the range from 35 to 55% by weight) and on the other surface a layer of a weldable synthetic plastic composition, for example a polyethylene ionomer. The fibrous mat which may consist of polyester, acrylic or polypropylene fibres is heat-bonded to the polyamide copolymer layer of the multilayer film. The film is resistant to delamination by the resin composition.
REFERENCES:
patent: 4243074 (1981-01-01), Strutzel et al.
patent: 4303711 (1981-12-01), Erk et al.
patent: 4537817 (1985-08-01), Guillaume
patent: 4568580 (1986-02-01), Ghirardello et al.
patent: 4569884 (1986-02-01), Weinand et al.
patent: 4647483 (1987-03-01), Tse et al.
patent: 4723579 (1988-02-01), Hyado et al.
patent: 4729926 (1988-03-01), Hotetes et al.
patent: 4735855 (1988-04-01), Wolford et al.
BCL Limited
Bell James J.
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