Multilayer capacitors using amorphous hydrogenated carbon

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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3613061, 3613063, 361307, 361309, 361314, 3613211, 3613214, 3613215, H01G 406, H01G 4228, H01G 4236

Patent

active

057743266

ABSTRACT:
A method of fabricating a multilayer capacitor includes depositing a plurality of electrode layers on a substrate alternately with a plurality of amorphous hydrogenated carbon dielectric layers, forming at least two holes in the electrode and dielectric layers with each hole intersecting alternating ones of the electrode layers, and providing an electrically conductive material in each hole for coupling the alternating ones of the electrode layers. Forming the holes can include forming initial holes and then further exposing selected edge portions of the electrode layers by widening dielectric layer portions of the initial holes. Providing the electrically conductive material can include coating surfaces of the holes with an electrically conductive layer and pouring an electrically conductive filler material into the holes. If filler material is poured into the holes, a capacitor lead can be positioned adjacent the filler material and attached by hardening the filler material.

REFERENCES:
patent: 3184661 (1965-05-01), Weller et al.
patent: 4376329 (1983-03-01), Behn
patent: 4378382 (1983-03-01), Behn
patent: 4508049 (1985-04-01), Behn et al.
patent: 5576925 (1996-11-01), Gorowitz et al.
U.S. Patent Application, "Low-Profile Capacitor, and Low-Profile Integrated Capacitor/Heatspreader" by Fisher, et al, Ser. No. 08/214,508 filed Mar. 18, 1994.
"Advanced Materials for High Energy Density Capacitors" by SJ Rzad, etal, 1992 IEEE 35th International Power Sources Symposium, Jun. 22-25, 1992, pp. 358-362.
"A New High Temperature Multilayer Capacitor with Acrylate Dieletrics" by Angelo Yializis, et al, IEEE Dec. 1990, vol. 13, No. 4, pp. 611-615.
"Dielectric Properties of Carbon Films from Plasma Enhanced Chemical Vapor Deposition" Davidson et al., Proc. Electrochem. Soc. v. 89-12, pp. 306-316 (no date provided).
"Multilevel DLC (Diamondlike Carbon) Capacitor Structure", JL Davidson, et al, SPIE vol. 871, Space Structures, Power & Power Conditioning (1988), pp. 308-312.
U.S. Patent Application, "Stacking of Three Dimensional High Density Interconnect Modules with Metal Edge Contacts" by by Saia, et al, Ser. No. 08/364,640 filed Dec. 27, 1994.

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