Multilayer board with built-in chip-type electronic...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S261000

Reexamination Certificate

active

07417196

ABSTRACT:
A chip-type electronic component built-in multilayer board includes a multilayer board including two or more layered dielectric layers and an inner conductor pattern, and a chip-type electronic component which is provided at the interface of the upper and lower dielectric layers and includes an external terminal electrode. The external terminal electrode is connected to an in-plane conductor provided at a interface via a first connection conductor extending along the chip-type electronic component in the lower direction from the interface of the upper and lower dielectric layers, and a second connection conductor extending along the chip-type electronic component in the upper direction from the interface of the upper and lower dielectric layers.

REFERENCES:
patent: 5876538 (1999-03-01), Steinle et al.
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6241838 (2001-06-01), Sakamoto et al.
patent: 6252481 (2001-06-01), Iwao et al.
patent: 6395118 (2002-05-01), Sakamoto et al.
patent: 6551427 (2003-04-01), Sakamoto et al.
patent: 6876091 (2005-04-01), Takeuchi et al.
patent: 7242591 (2007-07-01), Imamura et al.
patent: 2002/0026978 (2002-03-01), Harada et al.
patent: 2 197 540 (1988-05-01), None
patent: 60-182195 (1985-09-01), None
patent: 63-169798 (1988-07-01), None
patent: 3-109794 (1991-05-01), None
patent: 5-21930 (1993-01-01), None
patent: 06-32378 (1994-04-01), None
patent: 6-151635 (1994-05-01), None
patent: 9-92977 (1997-04-01), None
patent: 09-246727 (1997-09-01), None
patent: 11-163530 (1999-06-01), None
patent: 2001-60767 (2001-03-01), None
patent: 2002-84067 (2002-03-01), None
patent: 2003-332741 (2003-11-01), None
Official Communication for PCT Application NO. PCT/JP2005/009853; mailed on Sep. 6, 2005.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multilayer board with built-in chip-type electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer board with built-in chip-type electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer board with built-in chip-type electronic... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4012642

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.