Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2004-02-13
2008-09-09
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S829000, C029S847000, C029S852000, C174S255000
Reexamination Certificate
active
07421779
ABSTRACT:
A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials10, 30are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.
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Kiyoshi Takagi, “Build-up multi-layer printed wiring board technology” published by The Nikkan Kogyo Shinbun, Ltd., Jun. 20, 2001.
Higuchi Reiji
Ito Syouji
Nakao Osamu
Okamoto Masahiro
Fujikura Ltd.
Nguyen Donghai D.
Sughre Mion, PLLC
Trinh Minh
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