Multilayer board and a semiconductor device

Details Multilayer board and a semiconductor device Multilayer board and a semiconductor device

2007-12-18

2007-12-18

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S701000, C257S774000, C257S737000, C257SE23145

Reexamination Certificate

active

11366501

ABSTRACT:
Preparing a bottom grounding layer eliminates grounding pins, thereby the number of signal pins can be increased in a multilayer board that includes a grounding layer, a signal layer, a power supply layer, a grounding via, a signal via, a power supply via and the like in the insulation material of the multilayer board, the bottom grounding layer being electrically connected to the grounding layer.

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Office Action dated Feb. 27, 2007 issued in corresponding Japanese Application No. 2002-250936.
Office Action from the Japanese Patent Office dated May 22, 2007 issued in the corresponding Japanese Patent Application No. 2002-250936.

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