Multilayer board and a semiconductor device

Details Multilayer board and a semiconductor device Multilayer board and a semiconductor device

2006-04-18

2006-04-18

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S691000, C257S701000, C257S702000, C257S774000, C257S737000

Reexamination Certificate

active

07030480

ABSTRACT:
Preparing a bottom grounding layer eliminates grounding pins, thereby the number of signal pins can be increased in a multilayer board that includes a grounding layer, a signal layer, a power supply layer, a grounding via, a signal via, a power supply via and the like in the insulation material of the multilayer board, the bottom grounding layer being electrically connected to the grounding layer.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 6426468 (2002-07-01), Utsunomiya et al.
patent: 6861740 (2005-03-01), Hsu

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