Multilayer anisotropic conductive adhesive and connection...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

Reexamination Certificate

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C428S354000, C428S349000, C428S3550EP, C428S040100, C428S041800, C428S041700

Reexamination Certificate

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07901768

ABSTRACT:
A multilayer anisotropic conductive adhesive a plurality of adhesive layers that are laminated, each of which contains an insulating resin and a hardening agent. The conductive particles are contained either in a first plurality of adhesive layers or in a second plurality of adhesive layers, and at least the top or bottom adhesive layer has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Also, a connection structure is constructed in which a first electronic component having an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the multilayer anisotropic conductive adhesive.

REFERENCES:
patent: 4942190 (1990-07-01), Murayama et al.
patent: 6328844 (2001-12-01), Watanabe et al.
patent: 2001/0018477 (2001-08-01), Kumakura
patent: 2003/0017327 (2003-01-01), Paik et al.
patent: 2003/0029559 (2003-02-01), Yamada et al.
patent: 2003/0102466 (2003-06-01), Kumakura et al.
patent: 2003/0164457 (2003-09-01), Kumakura
patent: 5530401 (2001-04-01), None
patent: 1319636 (2001-10-01), None
patent: 5 320610 (1993-12-01), None
patent: 2000 340613 (2000-12-01), None
patent: 2001 302881 (2001-10-01), None
patent: 2001 323246 (2001-11-01), None
patent: 2001 0088423 (2001-09-01), None
patent: 2002 0091216 (2002-12-01), None
patent: 487935 (1991-05-01), None
patent: WO 98/03047 (1998-01-01), None
patent: WO 01 79374 (2001-10-01), None
Kumakura Hiroyuki et al., “Anisotropic Conductive Adhesive and Anisotropic Conductive Adhesive Sheet Using the Same”, abstract of JP 2005-097619A, Apr. 14, 2005.
Kumakura Hiroyuki, Connected Structure, Machine translation of JP 2001-031929, Feb. 6, 2001.
Hiroyuki, Kumakura et al. “Anisotropically Electroconductive Adhesive Film”, English translation of JP 09-115335, May 2, 1997.
Hiroyuki Kumakura et al., “Anisotropic Conductive Film”, English translation of JP 09-025467, Jan. 28, 1997.
Hiroyuki Kumakura et al. “Anisotropic Conductive Film”, English translation of JP 08-124424, May 17, 1996.
Yukio Yamada et al., “Anisotropic Conductive Film”, English translation of JP 08-115617, May 7, 1996.

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