Adhesive bonding and miscellaneous chemical manufacture – Methods – Relief or intaglio representations of three-dimensional...
Reexamination Certificate
1999-08-06
2001-09-04
Lam, Cathy (Department: 1775)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Relief or intaglio representations of three-dimensional...
C156S209000, C156S220000, C156S306900, C427S264000, C204S192100
Reexamination Certificate
active
06284072
ABSTRACT:
The present invention relates to multifunctional microstructures comprising fine line microcircuits and/or micro arrays of functionalising material, a method for production and the use thereof in microsystems, to apparatus for the production thereof, and to microsystems comprising the microstructures of the invention. In particular the invention relates to multifunctional microstructures comprising fine line circuitry and/or arrays of electrically active material associated with micro relief elements or arrays of elements for micro-optic, micro-fluidic, micro-electrical, micro-acoustic, micro-magnetic, micro-biological and/or micro-mechanical applications, to a method for production and use thereof in multifunctional microsystems, apparatus for the production thereof, and to multifunctional microsystems comprising the fine line structures.
For the development of new microsystems products there are requirements not only for microelectronics in chip form but also for a range of micromachined components that link, or are linked to, chip processors, for example display modules, sensors, actuators, power sources or information receiving/transmitting antennae.
In order to offer full microsystem solutions, microelectronic components need to be integrated with micromachined components. The microelectronic components allows the intelligence to be put into the system often through the use of silicon chips (ASICs). With miniaturisation of chips and the demand for increasing numbers of functions per unit area, there is a requirement for finer micromachined components, in particular interconnect structures, of increasing complexity, without loss of quality or robustness, that may be incorporated in flexible or rigid printed circuit boards for example.
A trend towards miniaturisation in manufacturing is well established, particularly in the microelectronics and computing fields. The requirements for small size and high precision are becoming increasingly important in other areas such as computer displays, healthcare products, fibre optics, communications and sensors of all kinds.
Whilst in some applications it is possible to integrate all microsystem functionality on a single chip, hybrid microsystems often outperform single substrate technology and can provide great flexibility. In hybrid microsystems the technology that is best suited to each component is employed and advanced interconnection techniques are used to link all the components or sub-systems together. This invention provides advanced interconnection products and techniques.
Single substrate fabrication depends on lithographic processes developed by the semi-conductor industry and involves the use of masks to allow exposure of patterns into photo-sensitive materials that allow selective etching to provide surface reliefs. More complex three dimensional or multi layer structures can be created by repeated use of deposition, exposure and etching processes.
Currently reel to reel techniques for production of flexible printed circuit boards employ lithography to introduce circuitry into copper filled laminates. Alternatively printing methods have been developed using lower conductivity materials such as conducting inks for applications where high resolution is not a requirement. Existing reel to reel printing and lithographic processes do not provide the requisite small size and precision demanded by industry trends and are limited in functionality.
There is therefore a need to provide high resolution miniaturised microstructures which are capable of supporting additional materials in multifunctional manner, and a convenient low cost, preferably reel to reel method for the production thereof, in particular in a variety of substrates and complexity of designs.
We have now surprisingly found that multifunctional microstructures may be provided which are capable of meeting the aforementioned objects in admirable manner and which may be produced by a convenient method which is associated with additional advantages and accesses a new range of uses and applications.
Accordingly in its broadest aspect there is provided according to the present invention a multifunctional microstructure which comprises at least one functionalising material associated with a microstructure wherein the microstructure comprises a layer of relief forming material preferably comprising an at least partially UV curable relief forming polymer having a plurality of relief features formed therein to provide at least one retaining feature; and wherein the functionalising material is deposited within and substantially or partially fills or lines the at least one retaining feature.
Preferably the system comprises:
a) An optional/dispensable first layer of a first substrate, the optional/dispensable first layer having a receptive surface capable of retaining a relief forming polymer,
b) an optionally dispensable second layer of a relief forming polymer that is preferably at least partially UV curable, over the receptive surface;
c) a plurality of optionally dispensable relief features formed in the second layer of relief forming material to provide at least one retaining structure; and
d) a third layer of at least one functionalising material deposited within and substantially or partially filling or lining the at least one retaining feature.
It is a particular advantage that the functionalising material may be deposited within the at least one retaining feature with thickness, deposit width or spacing between adjacent deposits of the order of micro level to molecular level, and may advantageously be used for microorders of 25 micron and less. The microstructure of the invention provides as a particularly novel feature the ability to achieve such deposits of the order of 15 micron and less, more preferably 10 micron and less. It is envisaged that the material may be deposited in dimensions down to even orders of 1 or 0.1 micron.
The functionalising material may comprise:
any substantially non UV curable non polymeric material such as a targeted growth material which may be obtained by deposition of a marker material such as a catalyst in the retaining features, with subsequent growth thereon; or
any partially or substantially UV curable polymeric material.
For applications requiring efficient electrical conduction the former is preferred, although the latter may be employed. Known materials therefore include any suitable metals, alloys, and/or composites of metallic and non-metallic magneto or electrically active materials. The present invention is therefore characterised by the integration of functionalising materials in microstructures which may be prepared in convenient manner with use of micromoulding technology. Reaction micromoulding or writing is preferred, for example micromoulding such as advancing line of contact UV embossing technology as disclosed in International Patent Applications PCT/GB94/02118 and PCT/GB96/01096 the contents of which are incorporated herein by reference, or progressive writing or dispensing UV freeforming technology using a suitable writing or dispensing nozzle associated with freeforming methods for example as in P D Calvert et al, Chem Mater 1997, 9(3), 650-663 “Chemical solid freeform fabrication: making shapes without moulds”. Moreover, multifunctional microstructures comprising non-polymeric, non-UV curable or polymeric, optionally UV curable functionalising materials in addition to polymeric at least partially UV curable relief forming materials may be produced by a novel adaptation of the UV embossing technology as disclosed in International applications above referred, in particularly advantageous manner. Specifically, the microstructure and method for the production thereof, according to the present invention have enabled the realisation of a whole range of new uses, by virtue of the unique nature thereof.
The relief forming material as hereinbefore defined may optionally comprise or include at least one functionalising material as hereinbefore defined which is the same as or different to, and is advantageously different to t
Harvey Thomas Grierson
Ryan Timothy George
Epigem Limited
Lam Cathy
Van Tassel & Associates
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