Multifunctional chip wire bonds

Details Multifunctional chip wire bonds Multifunctional chip wire bonds

1995-06-07

1997-07-08

Ramsey, Kenneth J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

2281805, H01L 2160

Patent

active

056464517

ABSTRACT:
A multifunctional chip includes first and second electrically isolated bonding pads. The chip also includes a control circuit coupled to the second bonding pad. The control circuit commands the chip to perform the first function if the first and second bonding pads are coupled. Alternatively, the control circuit commands the chip to perform the second function if the first and second bonding pads remain electrically isolated. The coupling or isolation between the first and second bonding pads is determined by wire bonds. Therefore, the use of wire bonds selects the function for the chip.

REFERENCES:
patent: 3478229 (1969-11-01), Avery
patent: 4558345 (1985-12-01), Dwyer et al.
patent: 4800393 (1989-01-01), Edward et al.
patent: 5142239 (1992-08-01), Brayton et al.
patent: 5386936 (1995-02-01), Mochida et al.
patent: 5395038 (1995-03-01), Olson et al.
PTO 1449.

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