Multifunction high frequency integrated circuit structure

Details Multifunction high frequency integrated circuit structure Multifunction high frequency integrated circuit structure

2000-02-04

2001-03-27

Mis, David (Department: 2817)

Oscillators

With distributed parameter resonator

C331S1170FE, C331S1170FE, C331S10800D, C331S172000, C331S175000, C331S17700V, C455S319000, C455S325000, C455S327000, C455S333000

Reexamination Certificate

active

06208214

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates generally to integrated circuits for millimeter-wave and microwave applications, and more particularly to a common circuit configuration which may be utilized to provide a variety of high frequency signal functions depending upon external components coupled thereto.
BACKGROUND OF THE INVENTION
The present invention generally relates to high-frequency circuit devices, and more particularly to millimeter-wave and microwave devices. State-of-the-are integrated circuit fabrication technology which permits low cost and low noise fabrication of such devices is commonly referred to as MMIC technology, and generally refers to both monolithic and hybrid manufacture processing techniques.
MMIC high frequency devices useful in the telecommunication and radar arts include among others, basic oscillators, voltage-controlled oscillators, mixers and converters, as well as injection locked signal sources having power greater than the injected signal. Each of the aforementioned high frequency devices is well known in the art and are embodied in wide array of circuit configurations employing a wide variety of circuit components including field effect transistors, varactors, diodes, and the like.
As is customary in MMIC technology, a new design configuration is elected for each new application. This of course adds both costs and time delays in program development. Thus there is a need for a common circuit module which performs a selected high frequency circuit function depending upon external components and/or one or more signal sources connected thereto.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a multifunction integrated circuit module for communication applications, which is easily fabricated in accordance with MMIC hybrid or integrated circuit fabrication techniques.
Another object of the present invention is to provide a multifunction integrated circuit module which serves as a baseline circuit configuration, and which may be employed as a selected high frequency device serving a particular high frequency circuit function depending upon external components connected thereto.
In accordance with the present invention, a multifunction high frequency integrated circuit structure and circuit configuration includes an oscillator circuit coupled to a buffer amplifier by way of a stripline coupler. The oscillator circuit includes an input-terminating region which is coupled to three input terminating ports. A first one of the input terminating ports is coupled directly to the resonator for either being electrically connected to a selected signal source or load, a second one of the input terminating ports is electrically connected to either a fixed or variable potential source, and the remaining input terminating port is coupled to the resonator input terminating region through another stripline coupler, and is intended to be electrically connected to another selected signal source. Depending upon the choice of circuit components and signal sources connected to the input terminating ports, the multifunction high frequency integrated circuit may serve as a voltage controlled oscillator, low phase noise oscillator, direct up or down frequency signal converter, or injection locked oscillator, among others.


REFERENCES:
patent: 5546056 (1996-08-01), Tokumitsu

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