Multiface wire bonding method and tool

Details Multiface wire bonding method and tool Multiface wire bonding method and tool

1974-09-30

1976-01-27

Smith, Al Lawrence

Metal fusion bonding

Process

Using high frequency vibratory energy

228 1, B23K 106

Patent

active

039347834

ABSTRACT:
A conductive wire is bonded to spaced parts of a semi-conductor device by an ultrasonic bonding wedge that is formed with side-by-side bonding faces of mutually different inclinations. One of the faces makes a forward bond having a lesser deformation at an inner end of the bond. The other of the bond faces is employed to make a rear bond in which a greater deformation is made at an outer end of the bond to facilitate parting of the wire at the second bond. A wire guide movably mounted adjacent the bonding wedge laterally shifts the wire from one bond face to the other.

REFERENCES:
patent: 3347442 (1967-10-01), Reber
patent: 3627192 (1971-12-01), Killingsworth
patent: 3648354 (1972-03-01), Mashino

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