Multidimensional process window optimization in...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C700S095000, C700S110000, C700S121000

Reexamination Certificate

active

07962234

ABSTRACT:
A method for optimizing multiple process windows in a semiconductor manufacturing process is disclosed. The method comprises performing dependent variable composition on a plurality of dependent variables. Metrology data is joined with the dependent variables, and then a partial least squares regression is performed on the joined data set to obtain a prediction equation, and a variable importance prediction for each process window in a process window set. A set of product limited yield are derived, and the process window, set is adjusted, and the yields recalculated, until an optimal process window set is derived.

REFERENCES:
patent: 5943550 (1999-08-01), Fulford et al.
patent: 6544429 (2003-04-01), Hung et al.
patent: 7333871 (2008-02-01), Schwarm
patent: 7386420 (2008-06-01), Zhang et al.
patent: 7502709 (2009-03-01), Funk et al.
patent: 7694244 (2010-04-01), Chan et al.
patent: 2002/0123818 (2002-09-01), Yamada et al.
patent: 2003/0097228 (2003-05-01), Satya et al.
patent: 2005/0010319 (2005-01-01), Patel et al.
patent: 2005/0252884 (2005-11-01), Lam et al.
patent: 2007/0142957 (2007-06-01), Miwa et al.
patent: 2008/0294281 (2008-11-01), Shimshi et al.
patent: 2008/0304057 (2008-12-01), Bills et al.
patent: 2009/0292385 (2009-11-01), Flach et al.
Umetrics AB, User's guide to SIMCA-P version 11), May 2005, pp. 133-193, 279, 303, 315 http://www.umetrics.com/Content/Document%20Library/Files/UserGuides-Tutorials/SIMCA-P—11—UG.pdf.

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