Multiconductor bonded connection assembly with direct thermal co

Details Multiconductor bonded connection assembly with direct thermal co Multiconductor bonded connection assembly with direct thermal co

1997-06-26

2000-07-25

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Insulated

174117FF, 174259, 257666, H01B 1102, H05K 102, H01L 23495

Patent

active

060938943

ABSTRACT:
A bonding opening exposing conductors through a cover of a multiconductor flat cable or electrical component to allow direct bonding thereof is described. The multiconductor flat cable or electrical component having a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.

REFERENCES:
patent: 4091529 (1978-05-01), Zaleckas
patent: 4644092 (1987-02-01), Gentry
patent: 4859614 (1989-08-01), Sugahara et al.
patent: 4954874 (1990-09-01), Miura
patent: 4979016 (1990-12-01), Lee
patent: 5006917 (1991-04-01), Kang et al.
patent: 5046953 (1991-09-01), Shreeve et al.
patent: 5059553 (1991-10-01), Berndlmaier et al.
patent: 5060049 (1991-10-01), Yamasaki et al.
patent: 5171716 (1992-12-01), Cagan et al.
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5235212 (1993-08-01), Shimizu et al.
patent: 5321204 (1994-06-01), Ko
patent: 5376588 (1994-12-01), Pendse
patent: 5378859 (1995-01-01), Shirasaki et al.
patent: 5389741 (1995-02-01), Ueno
patent: 5446239 (1995-08-01), Mizutani et al.
patent: 5455394 (1995-10-01), Durand et al.
patent: 5476815 (1995-12-01), Kawasumi
patent: 5525546 (1996-06-01), Harada et al.
patent: 5528078 (1996-06-01), Shin
patent: 5554825 (1996-09-01), Parker et al.
"High Precision Flexible Printed Circuits", Y. Tanaka et al., Mektec Technical Update, Sep. 1994, vol. #5, pp. 1-8.

Affiliated with

Also associated with

Rating

Multiconductor bonded connection assembly with direct thermal co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiconductor bonded connection assembly with direct thermal co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiconductor bonded connection assembly with direct thermal co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1338044