Multicomponent integrated circuit package

Details Multicomponent integrated circuit package Multicomponent integrated circuit package

1991-10-11

1993-06-15

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

361393, 361396, 361421, 174 522, 174260, H05K 702

Patent

active

052204898

ABSTRACT:
An electronic package, comprising a circuit carrying substrate (30) and a semiconductor device (35). The substrate (30) has two opposing surfaces, the first or bottom surface having a plurality of solder pads (31) and the second or top surface having a circuitry pattern defined on it. A semiconductor device (35) is attached to the top surface of the circuit carrying substrate (30). A molded body (33) is formed completely around the semiconductor device (35) in order to encapsulate it, the molded body also substantially covering the top surface of the circuit carrying substrate (30). A layer of metal deposited directly on the molded body and the top surface of the circuit carrying substrate is delineated into another conductive circuitry pattern (38), with part of the pattern (36) connected to the circuitry pattern on the circuit carrying substrate. An electronic component (32) is mounted on the molded body (33) and electrically connected to the conductive circuitry pattern (38).

REFERENCES:
patent: 4521828 (1985-06-01), Fanning
patent: 4604168 (1986-08-01), Liu et al.
patent: 5018005 (1991-05-01), Lin et al.
patent: 5045914 (1991-09-01), Casto et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5153385 (1992-10-01), Juskey et al.

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