Multichip semiconductor structures with interchip electrostatic

Details Multichip semiconductor structures with interchip electrostatic Multichip semiconductor structures with interchip electrostatic

1995-02-22

1997-12-30

Gaffin, Jeffrey A.

Electricity: electrical systems and devices

Safety and protection of systems and devices

Transient responsive

361 56, 361735, H02H 322

Patent

active

057037477

ABSTRACT:
Interchip and intrachip electrical discharge suppression connections or networks are disclosed for three-dimensional multichip semiconductor structures. The interchip suppression networks electrically intercouple the power planes of the semiconductor device chips in the structure. This, in combination with conventional intrachip suppression networks present on the external connects or input/output pins of the individual chips in the structure, provides complete power plane-to-power plane, external connect-to-power plane and external connect-to-external connect protection against electrical discharge events, such as an electrostatic discharge occurring during handling and testing of the structure. The interchip electrical discharge suppression networks can be placed on an end layer or end semiconductor chip of the three-dimensional multichip semiconductor structure and connect to individual chips in the structure via an edge surface metallization. Techniques for suppressing electrical discharges occurring during the fabrication of three-dimensional multichip semiconductor structure are also disclosed.

REFERENCES:
patent: 4456800 (1984-06-01), Holland
patent: 4608592 (1986-08-01), Miyamoto
patent: 4677520 (1987-06-01), Price
patent: 4727410 (1988-02-01), Higgins, III
patent: 4894706 (1990-01-01), Sato et al.
patent: 4937471 (1990-06-01), Park et al.
patent: 5012924 (1991-05-01), Murphy
patent: 5359211 (1994-10-01), Croft

Affiliated with

Also associated with

Rating

Multichip semiconductor structures with interchip electrostatic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multichip semiconductor structures with interchip electrostatic , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multichip semiconductor structures with interchip electrostatic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-208187