Multichip packaged semiconductor device and method for manufactu

Details Multichip packaged semiconductor device and method for manufactu Multichip packaged semiconductor device and method for manufactu

1993-05-17

1994-10-04

Thomas, Tom

Fishing, trapping, and vermin destroying

437211, 437214, 437217, H01L 2160

Patent

active

053526325

ABSTRACT:
A plurality of semiconductor chips are mounted on a plurality of islands formed on a lead frame. Inner lead portions of the lead frame and electrode pads formed on the semiconductor chips are electrically connected to one another via first lead portions formed on a flexible resin tape and the electrode pads formed on the semiconductor chips are connected to one another via second lead portions formed on the flexible resin tape. The flexible resin tape on which the islands and inner lead portions of the lead frame, the plurality of semiconductor chips and the first and second lead portions are formed is sealed into a resin package.

REFERENCES:
patent: 4264917 (1981-04-01), Ugon
patent: 4709468 (1987-12-01), Wilson
patent: 4755866 (1988-07-01), Marshall et al.
patent: 4994411 (1991-02-01), Naito et al.
patent: 5032542 (1991-07-01), Kazami et al.
patent: 5034350 (1991-07-01), Marchisi
patent: 5084753 (1992-01-01), Goida et al.
patent: 5096852 (1992-03-01), Hobson
patent: 5138436 (1992-08-01), Koepf
patent: 5188984 (1993-02-01), Nishiguchi
Nikkei Microdevices, pp. 95-101 (Feb., 1989).

Affiliated with

Also associated with

Rating

Multichip packaged semiconductor device and method for manufactu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multichip packaged semiconductor device and method for manufactu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multichip packaged semiconductor device and method for manufactu will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-581096