Multichip package having outer and inner power supply means

Details Multichip package having outer and inner power supply means Multichip package having outer and inner power supply means

1986-08-05

1988-05-03

James, Andrew J.

357 75, 357 80, 357 70, H01L 2302

Patent

active

047423854

ABSTRACT:
For uniform distribution of power to integrated circuit chips arranged on a substrate, a multichip package comprises a plurality of power feed contact pads on an outer portion of the substrate for coupling to an external power source and a pair of power feed pins on an inner portion of the substrate for coupling to the external power source. A conductive means is provided on the substrate for distributing power from the power feed contact pads and the power feed pins to the integrated circuit chips.

REFERENCES:
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4127830 (1978-11-01), Chalifour et al.
IBM Technical Disclosure Bulletin, vol. 23, No. 7A, Dec. 1980, pp. 2770-2773.

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