Multichip module with multilayer wiring substrate

Details Multichip module with multilayer wiring substrate Multichip module with multilayer wiring substrate

1991-11-26

1993-11-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174254, 257700, 361744, 361767, H05K 114

Patent

active

052588912

ABSTRACT:
Multichip module is provided with standard wiring layers comprising standardized wiring patterns, a custom wiring layer comprising customized wiring patterns and chip mounting pads, a plurality of antifuses which are positioned in standardized installation positions and each of which provides the possibility of defining the presence or absence of an electrical connection between a specified conductive track of a standard wiring layer and a specified conductive track of the custom wiring layer, and a plurality of wafer chips which are electrically connected to the chip mounting pads and mounted on the chip mounting pads, whereby disadvantages of hybrid integrated circuits are overcome while offering numerous advantages of hybrid integrated circuits.

REFERENCES:
patent: 4598166 (1986-07-01), Neese
patent: 4685033 (1987-08-01), Inoue
patent: 4739448 (1988-04-01), Rowe et al.
patent: 4782193 (1988-11-01), Linsker
patent: 4795670 (1989-01-01), Nishigaki et al.
L. H. Hyden et al., "Silicon Circuit Boards Off-the-Shelf Convenience", Electronic Packaging & Production, vol. 28, No. 4, Apr. 1988.
Y. C. Lee, "Design of HWSI Multichip Modules for Quick Prototyping and Manufacturing", 40th Electronic Components & Technology Conference, pp. 586-591.
E. M. Hubacher, "Low Cost Multi-Chip Package", IBM Technical Disclosure Bulletin, vol. 27, No. 4B, Sep. 1984.

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