Multichip module with integrated test circuitry disposed within

Details Multichip module with integrated test circuitry disposed within Multichip module with integrated test circuitry disposed within

1994-08-17

1996-05-14

Beausoliel, Jr., Robert W.

Excavating

324 731, 371 251, G01R 3128, G06F 1100

Patent

active

055175155

ABSTRACT:
A multichip module (MCM) and associated fabrication technique are presented wherein a test circuit is disposed within the interposer substrate of the MCM to facilitate testing of the module's integrated circuit chips and testing of the interconnect wiring between integrated circuit chips. The test circuitry, disposed within the interposer substrate comprises semiconductor logic circuitry that electrically connects to the integrated circuit chips of the module. In the various multiplexer latch and shift register latch embodiments disclosed, active test circuitry within the interposer substrate is minimized and is essentially transparent to the integrated circuit chip designs incorporated in the MCM.

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Maunder et al., "The Test Access Port and Boundary-Scan Architecture," IEE Computer Society Press Tutorial, Chap. 4, pp. 33-49, 1990.

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