Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-10-18
1995-05-02
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361767, 361790, 361808, 174255, H05K 111
Patent
active
054125391
ABSTRACT:
An inexpensive arrangement for mounting multiple, closely spaced integrated circuit chips (18, 20, 22, 24) on a low temperature co-fired ceramic (LTCC) substrate (10) uses a mandrel-produced thin film decal (26) having patterns of interconnecting conductive traces (34, 46, 47) that connect to the fine pitch connecting pads (60) of the integrated circuit chips at one end and connect to the relatively coarse pitch connecting pads (50) of the low temperature co-fired ceramic substrate at the other end. The interconnect decal is formed independently of the LTCC substrate and is provided with chip connections at a pitch of about 0.004 inches. The interconnect pads of the decal are connected by conductive traces on the decal to the LTCC pads which have a pitch in the order of about 0.01 inches or greater. The decal, which is formed independently of the LTCC substrate, is connected to the substrate pads by one of several different electrically conductive adhesives, including silver loaded epoxy, Z-axis conductive epoxy and anisotropically and isotropically conductive epoxy or low melting temperature solder. The decal enables use of a "fan-out" arrangement in which connections are routed under the chip.
REFERENCES:
patent: 5245135 (1993-09-01), Schreiber et al.
patent: 5280413 (1994-01-01), Pai
Bowers Harold C.
Crumly William R.
Elwell Dennis F.
Denson-Low W. K.
Gudmestad Terje
Hughes Aircraft Company
Leitereg Elizabeth E.
Picard Leo P.
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