Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-07-19
1996-08-06
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174255, 361749, H05K 114
Patent
active
055440177
ABSTRACT:
A multichip module substrate for use in a three-dimensional multichip module, and methods of making the same, are disclosed. The substrate comprises a thin film structure, for routing signals to and from integrated circuit chips, formed over a rigid support base. Apertures are formed in the support base exposing the underside of the thin film structure, thereby allowing high density connectors to be mounted on both surfaces of the thin film structure, greatly enhancing the ability to communicate signals between adjacent substrates in the chip module. This avoids the need to route the signals either through the rigid support base or to the edges of the thin film structure. Power and ground, which do not require a high connection density, are routed in low impedance paths through the support base. Preferably, the thin film structure is made of alternating layers of patterned metal, such as copper, and a low dielectric organic polymer, such as a polyimide.
REFERENCES:
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 4237606 (1980-12-01), Niwa et al.
patent: 4480288 (1984-10-01), Gazdik
patent: 4509099 (1985-04-01), Takamutsu
patent: 4648179 (1987-03-01), Bhattacharyya et al.
patent: 4937659 (1990-06-01), Chall, Jr.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5055907 (1991-10-01), Jacobs
patent: 5136471 (1992-08-01), Inasaka
patent: 5155661 (1992-10-01), Nagesh
patent: 5309324 (1994-05-01), Herandez
patent: 5334804 (1994-08-01), Love
patent: 5355282 (1994-10-01), Yokemura
patent: 5396034 (1995-03-01), Fujita
patent: 5426563 (1995-06-01), Moresco
"Power Grid Image For Embedded Arrays," IBM Technical Disclosure Bulletin, vol. 32, No. 8B, Jan. 1990.
Beilin Solomon I.
Chou William T.
Kudzuma David
Lee Michael G.
Murase Teruo
Fujitsu Limited
Tolin Gerald P.
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