Multichip module for surface mounting on printed circuit boards

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361733, 361789, 361790, 257678, 257687, H05K 103, H05K 111, H05K 114, H01L 2315

Patent

active

061543721

ABSTRACT:
A ceramic substrate secured with a flexible adhesive to a first side of a printed circuit board that belongs to a module and has circuit structures is provided. The ceramic substrate is contacted to the circuit structures with bond connections. The terminal elements are formed by approximately spherical accumulations of solder attached on the backside of the printed circuit board, these solder accumulations being connected to the circuit structures on the first side of the printed circuit board via through-contactings.

REFERENCES:
patent: 4709301 (1987-11-01), Yamaguti
patent: 5045914 (1991-09-01), Casto et al.
patent: 5220489 (1993-06-01), Barreto et al.
patent: 5222014 (1993-06-01), Lin
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5280413 (1994-01-01), Pai
patent: 5319243 (1994-06-01), Leicht et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5552637 (1996-09-01), Yamagata
patent: 5666270 (1997-09-01), Matsuda et al.
patent: 5841190 (1998-11-01), Noda et al.
patent: 5847453 (1998-12-01), Uematsu et al.
D.B. Whitney, "Chip-On-Board Yields Inexpensive Microcontroller", 8307 Electronic Packaging & Production 28(1988)Jun., Nr. 6, Newton, Mass., USA, pp. 80-81.
IBM Technical Disclosure Bulletin, "Module Interconnection Using Hybrid Attachment", vol. 35, No. 7, Dec. 1992, pp. 330-331.
K. Umezawa et al., "A High-Performance GaAs Multichip Package For Supercomputers", 298 NEC Reserach & Development 33(1992) Jan., No. 1, Tokyo, Japan, pp. 32-39.

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