Multichip module for LOC mounting and method for producing...

Details Multichip module for LOC mounting and method for producing... Multichip module for LOC mounting and method for producing...

2007-10-02

2007-10-02

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000

Reexamination Certificate

active

10022605

ABSTRACT:
A multichip module for leads-on-chip mounting is described. The multichip module has a lead-frame, a common, contiguous part of a wafer slice disposed in the lead-frame, and a number of semiconductor chips disposed next to one another in the lead-frame. At least some of the semiconductor chips disposed in the lead-frame are disposed on the common, contiguous part of the wafer slice.

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patent: 5559305 (1996-09-01), Lee et al.
patent: 5583375 (1996-12-01), Tsubosaki et al.
patent: 6246615 (2001-06-01), King et al.
patent: 43 01 915 (1994-05-01), None
patent: 197 04 385 (1997-08-01), None
patent: 197 12 551 (1997-11-01), None

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