Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-05-25
2001-09-04
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C333S186000, C333S246000, C361S784000
Reexamination Certificate
active
06285559
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a multichip module (MCM) including a semiconductor device and a surface acoustic wave (SAW) filter device mounted on a ceramic substrate.
There is an increasing demand for a miniature portable apparatus, e.g., a handy phone which is smaller in size and weight and integrated to a higher degree and features more advanced functions.
A conventional MCM constructed to meet the above demand has a problem that it cannot reduce the mounting area because a plurality of devices are arranged side by side in a hermetic container. Further, the conventional MCM is expensive and heavy. In addition, it is difficult to electrically connect the various devices because they are arranged in a single space and connected together by bonding wires.
Japanese Patent Laid-Open Publication No. 7-153903 discloses an MCM including an MCM substrate for mounting a semiconductor chip. A frame is provided on the MCM substrate in such a manner as to surround the semiconductor chip. Seal resin is filled in a gap between the frame and the semiconductor chip for sealing the chip. Electrode terminals are arranged on the surface of the frame opposite to the MCM substrate and electrically connected to circuitry formed on the substrate. The electrode terminals are implemented by solder bumps or conductive paste. The semiconductor chip is mounted on one major surface of the MCM substrate to be mounted to a motherboard. Semiconductor packages each including the above MCM substrate loaded with the semiconductor chip are stacked in order to enhance the efficient mounting of semiconductor chips. However, the mounting efficiency achievable with this configuration is limited because an LSI (Large Scale Integrated circuit) chip is mounted on only one major surface of the MCM substrate.
Technologies relating to the present invention are also disclosed in, e.g., Japanese Patent Laid-Open Publication Nos. 7-131129, 8-78616 and 8-153834.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide an MCM capable of enhancing the efficient mounting of devices and facilitating insulation between the devices.
An MCM of the present invention includes a first substrate formed with through holes and having shield electrodes arranged therein. At least one semiconductor device is mounted on one major surface of the first substrate and electrically and mechanically connected to the first substrate by a first conductive material. A second substrate is mounted on the other major surface of the first substrate and formed with through holes. At least one filter device is mounted on the other major surface of the first substrate and electrically and mechanically connected to the first substrate by a second conductive material. The second substrate is electrically connected to the semiconductor device by the through holes and first conductive material.
REFERENCES:
patent: 5422615 (1995-06-01), Shibagaski et al.
patent: 5438305 (1995-08-01), Hikita et al.
patent: 5872331 (1999-02-01), Ando et al.
patent: 5920142 (1999-07-01), Onishi et al.
patent: 6057600 (2000-05-01), Kitazawa et al.
patent: 6078123 (2000-06-01), Tanaka et al.
patent: 0 540 247 A2 (1993-05-01), None
patent: 0 708 484 A1 (1996-04-01), None
patent: 7-131129 (1995-05-01), None
patent: 7-153903 (1995-06-01), None
patent: 8-78616 (1996-03-01), None
patent: 8-153834 (1996-06-01), None
Gandhi Jayprakash N.
McGuireWoods LLP
NEC Corporation
Tran Thanh Y.
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