Multichip module

Details Multichip module Multichip module

1993-03-01

1995-04-25

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 174262, 361805, 361794, 361795, H05K 103

Patent

active

054101077

ABSTRACT:
An electrical interconnection medium having first and second overlying interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second interconnection layers being oriented orthogonal to each other, the conductors being interconnected so as to form at least two electrical planes, the conductors of the electrical planes being substantially interdigitated on each interconnection layer, portions of each plane appearing on both layers. The interconnection medium advantageously is employed as a multichip module.

REFERENCES:
patent: 3846166 (1974-11-01), Saiki et al.
patent: 4675717 (1987-06-01), Herrero et al.
patent: 4811082 (1989-03-01), Jacobs
patent: 4866507 (1989-09-01), Jacobs
patent: 4927983 (1990-05-01), Jones et al.
patent: 4956749 (1990-09-01), Chang
patent: 5165166 (1992-11-01), Carey
patent: 5272600 (1993-01-01), Carey
H. Hashemi, et al., "Electrical Characterization of a Reduced Metal Layer Copper-Polymide Multi-Chip Module Structure", Microelectronics & Computer Technology Corp. (MCC), Sep., 1992.

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