Multichip module

Details Multichip module Multichip module

2007-06-05

2007-06-05

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S027000, C333S236000

Reexamination Certificate

active

10495290

ABSTRACT:
A bondwire transition arrangement for interconnecting a signal port on one IC of a multichip module with a signal port on another, adjacent, IC of the same module employs a distributed signal-transition process in which the signal on one port appears as subsignals at tapping points along a series transmission-line segment arrangement between that port and ground on the same IC and the subsignals are recombined along a second series transmission-line segment arrangement connected between the other port and ground on the other IC. Spatially corresponding tapping points are interconnected via bondwires.

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patent: 5412339 (1995-05-01), Takano
patent: 6400226 (2002-06-01), Sato
Optimum Microstrip Interconnects, S. Nelson, et al., Microwave Symposium Digest, 1991., IEEE MTT-S International, Boston, MA, Jun. 10, 1991, New York, New York, pp. 1071-1074.
Interconnects And Packaging of Millimeter Wave Circuits, W. Menzel, Millimeter Waves, 1997 Topical Symposium on Kanagawa, Japan, Jul. 7-8, 1997, New York, New York, IEEE, pp. 55-58.

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