Multichip integrated circuit packaging method

Details Multichip integrated circuit packaging method Multichip integrated circuit packaging method

1989-08-08

1990-04-24

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

437209, H05K 334

Patent

active

049188119

ABSTRACT:
A multichip integrated circuit package comprises a substrate to which is affixed one or more integrated circuit chips having interconnection pads. A polymer film overlying and bridging integrated circuit chips present is provided with a plurality of via openings to accommodate a layer of interconnection metallization which serves to connect various chips and chip pads within the interconnection pads disposed on the chips. A significant advantage of the packaging method and configuration of the present invention is the ability for the polymer film to be removed. This significantly improves testability and effectively provides wafer scale integration circuit packages which are free of problems associated with yield and testability.

REFERENCES:
patent: 3501832 (1970-03-01), Iwata et al.
patent: 3903590 (1975-09-01), Yokogawa
patent: 4709468 (1987-12-01), Wilson

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