Multichip IC module having coplanar dice and substrate

Details Multichip IC module having coplanar dice and substrate Multichip IC module having coplanar dice and substrate

1988-08-05

1989-12-26

James, Andrew J.

357 72, 357 80, 357 81, H01L 2302, H01L 2312

Patent

active

048901563

ABSTRACT:
A multichip IC module having dice and substrates coplanarly bonded therein. After the dice are aligned into die openings of the substrate, a glass slurry is applied and the module is fired to solidify the glass. Because of shrinkage of the glass slurry firing, a groove results between the dice and the substrate. To fill on this groove, a polyimide or like film is adhered and then pressued and cured on the surface of the dice and substrate. This film is used as a base for interconnect lines.

REFERENCES:
patent: 4466181 (1984-08-01), Takishima
patent: 4630096 (1986-12-01), Drye et al.
patent: 4675985 (1987-06-01), Goto
patent: 4722914 (1988-02-01), Drye et al.
patent: 4745455 (1988-05-01), Glascock, II et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4843035 (1989-06-01), Takishima

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