Multichannel cooling system with magnetohydrodynamic pump

Heat exchange – With timer – programmer – time delay – or condition responsive... – Temperature responsive or control

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S299000, C165S080400, C165S080500, C165S104310, C165S104330, C361S698000, C361S699000, C361S701000, C361S702000, C361S703000, C257S714000, C417S050000

Reexamination Certificate

active

07870893

ABSTRACT:
A cooling device includes a base having cells. A pipe is coupled to the base for each of the cells. The pipes include passages that carry fluid toward the cell and away from the cell. A magnetohydrodynamic pump system coupled to the pipe circulates an electrically conductive cooling fluid within the passages and the cell. An orifice may emits jets of fluid into the cells. A controller coupled to the cooling device may independently control flow rates in two or more cells of the cooling device. The controller may receive information from the temperature sensors on the base of the cooling device for use in controlling the flow rates in the cells.

REFERENCES:
patent: 4791548 (1988-12-01), Yoshikawa et al.
patent: 5032897 (1991-07-01), Mansuria et al.
patent: 5099910 (1992-03-01), Walpole et al.
patent: 5195102 (1993-03-01), McLean et al.
patent: 5220171 (1993-06-01), Hara et al.
patent: 5228502 (1993-07-01), Chu et al.
patent: 5355942 (1994-10-01), Conte
patent: 5724818 (1998-03-01), Iwata et al.
patent: 5727618 (1998-03-01), Mundinger et al.
patent: 5918469 (1999-07-01), Cardella
patent: 5921087 (1999-07-01), Bhatia et al.
patent: 5960866 (1999-10-01), Kimura et al.
patent: 6094919 (2000-08-01), Bhatia et al.
patent: 6233959 (2001-05-01), Kang et al.
patent: 6233960 (2001-05-01), Kang et al.
patent: 6250085 (2001-06-01), Tousson
patent: 6338251 (2002-01-01), Ghoshal et al.
patent: 6424533 (2002-07-01), Chu et al.
patent: 6453678 (2002-09-01), Sundhar
patent: 6463743 (2002-10-01), Laliberte
patent: 6512291 (2003-01-01), Dautartas et al.
patent: 6559538 (2003-05-01), Pomerene et al.
patent: 6581388 (2003-06-01), Novotny et al.
patent: 6645786 (2003-11-01), Pomerene et al.
patent: 6658861 (2003-12-01), Ghoshal et al.
patent: 6708501 (2004-03-01), Ghoshal et al.
patent: 6711904 (2004-03-01), Law et al.
patent: 6743972 (2004-06-01), Macris
patent: 6903929 (2005-06-01), Prasher et al.
patent: 6917522 (2005-07-01), Erturk
patent: 6950773 (2005-09-01), Gross et al.
patent: 6987668 (2006-01-01), Kitano et al.
patent: 6989134 (2006-01-01), Tonkovich et al.
patent: 7000684 (2006-02-01), Kenny et al.
patent: 7002801 (2006-02-01), Zeighami et al.
patent: 7020802 (2006-03-01), Gross et al.
patent: 7058101 (2006-06-01), Treusch et al.
patent: 7076389 (2006-07-01), Gross et al.
patent: 7085681 (2006-08-01), Williams et al.
patent: 7131486 (2006-11-01), Goodson et al.
patent: 7342787 (2008-03-01), Bhatia
patent: 7436059 (2008-10-01), Ouyang
patent: 2003/0085024 (2003-05-01), Santiago et al.
patent: 2003/0235504 (2003-12-01), Lemoff et al.
patent: 2004/0112585 (2004-06-01), Goodson et al.
patent: 2004/0182088 (2004-09-01), Ghoshal et al.
patent: 2004/0234379 (2004-11-01), Miner et al.
patent: 2004/0234392 (2004-11-01), Ghoshal et al.
patent: 2004/0251539 (2004-12-01), Faris et al.
patent: 2005/0087767 (2005-04-01), Fitzgerald et al.
patent: 2005/0139345 (2005-06-01), Pokharna et al.
patent: 2005/0150535 (2005-07-01), Samavedam et al.
patent: 2005/0150536 (2005-07-01), Ngai et al.
patent: 2005/0150537 (2005-07-01), Ghoshal
patent: 2005/0150539 (2005-07-01), Ghoshal et al.
patent: 2005/0160752 (2005-07-01), Ghoshal et al.
patent: 2005/0189089 (2005-09-01), Miner
patent: 2005/0205241 (2005-09-01), Goodson et al.
patent: 2005/0211417 (2005-09-01), Upadhya et al.
patent: 2006/0073024 (2006-04-01), Goshal et al.
patent: 1995407202094 (1997-02-01), None
U.S. Patent and Trademark Office, “Office Action” for U.S. Appl. No. 11/601,527 mailed Jan. 14, 2008, available in PAIR.
U.S. Patent and Tradmark Office, “Office Action” for U.S. Appl. No. 11/523,435 mailed Aug. 29, 2008, available in PAIR.
U.S. Patent and Trademark Office, “Final Office Action” for U.S. Appl. No. 11/523,435 mailed Jan. 29, 2009, available in PAIR.
U.S. Patent and Trademark Office, “Office Action” for U.S. Appl. No. 11/523,435 mailed Apr. 16, 2009, available in PAIR.
U.S. Patent and Trademark Office, “Notice of Allowance” for U.S. Appl. No. 11/523,435 mailed Oct. 27, 2009, available in PAIR.
“TEC Integrated Heat Sinks”, Enertron Custom Design & Manufacturing of Thermal Management System; Enertron, Inc., Mesa, AZ., 2002, 1 pg.
“Laser Module cooling, Design Goals and Constraints”, Enertron Total Thermal Management Solutions, Enertron, Inc., Mesa, AZ, 2002, 1 pg.
Garner, Scott D., “Heat pipes for electronics cooling applications” Electronics Cooling, Thermacore, Inc., Lancaster, PA., 2001, 10pgs.
“subZero4G Thermo-Electric Cooling”, Thermaltake SubZero4G Thermo-Electric Cooling, Thermaltake Technology Co., Ltd., City of Industry, CA., 2003, 6 pgs.
“The Cooligy Electrokinetic Pump”, http://web.archive.org/web/20040630060103/www.cooligy.com/electrokinetic—pump.html, dated Jul. 25, 2004, 2 pgs.
“Advanced Microchannel Cooling Loop”, http://web.archive.org/web/20040725041209/www.cooligy.com/microchannels.html, dated Jul. 25, 2004, 4 pgs.
“Microchannel Cooling”, http://web.archive.org/web/20040619033221/www.cooligy.com/microchannels.html, dated Jul. 25, 2004, 3 pgs.
Hughes, Ronnie D. “Remote Diodes Yield Accurate Temperature Measurements”, National Semiconductor, Jul. 10, 2003, Located on Manufacturing.net at http://www.manufaturing.net/article/CA307863?ticker-NSM on Feb. 1, 2004 (4 pgs.).
Co-pending U.S. Appl. No. 11/601,527, “Thermoelectric Cooling Device Arrays”, to Ouyang, filed Nov. 17, 2006.
Co-pending U.S. Appl. No. 11/523,435, “Intelligent Microchannel Cooling”, to Ouyang, et al., filed Sep. 19, 2006.
Snyder, G. Jeffrey, et al. “Hot Spot Cooling Using Embedded Thermoelectric Coolers”, Nextreme Thermal Solutions, Research Triangle Park, NC, 22nd IEEE Semi-Therm Symposium, 2006 (9 pgs. beginning on p. 135).
Thermocore Thermal Management Solutions, Advanced Cooling Solutions for a Changing World, Electronics Cooling Group of MODINE Applied Thermal Innovation, Modine Manufacturing Company, 2005 (12 pgs).
Venkatasubramanlan, Rama, et al. “Thin-Film Thermoelectric Devices with High Room-Temperature Figures of Merit”, Macmillan Magazines Ltd, Nature, vol. 413, Oct. 11, 2001, www.nature.com, Research Triangle Institute, Research Triangle Park, NC (pp. 597-602).
Moore, Bruce D. “IC Temperature Sensors Find the Hot Spots,” Maxim Integrated Products, www.edmag.com, EDN Jul. 2, 1998, Sunnyvale, CA (pp. 99-110).
Maxim “+ 1°C, SMBus-Compatible Remote/Local Temperature Sensors with Overtemperature Alarms”, Maxim Integrated Products, Sunnyvale, CA MAX6657/MAX6658/MAX6659, www.maxim-ic.com, Rev. 4; 5/06 (pp. 1-17).
Dallas Semiconductor Maxim “MAX6657, MAX6658, MAX6659” Overview: + 1°C, SMBus-Compatible Remote/Local Temperature Sensors with Overtemperature Alarms, Maxim Integrated Products, 2006 (2 pgs.).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multichannel cooling system with magnetohydrodynamic pump does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multichannel cooling system with magnetohydrodynamic pump, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multichannel cooling system with magnetohydrodynamic pump will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2727696

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.