Multichamber sputtering apparatus

Details Multichamber sputtering apparatus Multichamber sputtering apparatus

1997-05-20

1999-07-20

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429807, 20429809, 20429815, C23C 1456

Patent

active

059252278

ABSTRACT:
A multichamber sputtering apparatus which is used for manufacturing a semiconductor device and the like. In the apparatus, a plurality of sputter chambers and a degas chamber are airtightly connected to and arranged around a center transfer chamber, and processes including sputtering are continuously conducted in a vacuum. A plurality of heat stages are disposed in the degas chamber so that a plurality of substrates are simultaneously heated. In each heat stage, as required, a heating gas introducing unit for introducing a heating gas with causing the heating gas to make contact with the rear face of the substrate, a pressing mechanism which presses the substrate against the heat stage so as to enhance the surface contact between the heat stage and the substrate, or an electrostatic chucking mechanism is disposed.

REFERENCES:
patent: 4978412 (1990-12-01), Aoki et al.
patent: 4994162 (1991-02-01), Armstrong et al.
patent: 5067218 (1991-11-01), Williams
patent: 5267607 (1993-12-01), Wada
patent: 5310410 (1994-05-01), Begin et al.
patent: 5504043 (1996-04-01), Ngan et al.
patent: 5618350 (1997-04-01), Ishikawa et al.

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