Abrading – Abrading process – Combined abrading
Reexamination Certificate
2006-02-14
2006-02-14
Nguyen, George (Department: 3723)
Abrading
Abrading process
Combined abrading
C451S041000, C451S066000, C451S005000
Reexamination Certificate
active
06997788
ABSTRACT:
A chemical mechanical polishing method is disclosed in which a batch of wafers is first supplied to a low-selectivity, first CMP tool for partly polishing the batch with one or more relatively non-selective CMP slurries (e.g., silica (SiO2) based); and in which the batch of partly-polished wafers is subsequently transferred to a higher-selectivity, second CMP tool which uses one or more comparatively more-selective CMP slurries (e.g., ceria (CeO2) based) to further the polishing of the batch of partly-polished wafers and/or to complete the polishing of the partly-polished wafers.
REFERENCES:
patent: 5676587 (1997-10-01), Landers et al.
patent: 6203404 (2001-03-01), Joslyn et al.
patent: 6224465 (2001-05-01), Meyer
patent: 6227949 (2001-05-01), Yi et al.
patent: 6227950 (2001-05-01), Hempel et al.
patent: 6338667 (2002-01-01), Sandhu et al.
patent: 6431959 (2002-08-01), Mikhaylich et al.
patent: 6594542 (2003-07-01), Williams
patent: 6632124 (2003-10-01), Adams et al.
patent: 6726535 (2004-04-01), Shih et al.
patent: 2002/0100743 (2002-08-01), Bonner et al.
patent: 2003/0036339 (2003-02-01), Bonner et al.
Gan Richard
Wong Karen
Wu Kuo-Chun
Gimlan Gideon
MacPherson Kwok & Chen & Heid LLP
Mosel Vitelic Inc.
Nguyen George
LandOfFree
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