Multi-tip module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

361774, 257738, 257780, H05K 111, H05K 114, H01L 2312

Patent

active

060184620

ABSTRACT:
An electrical pad for installation to a board, formed on the module substrate on which a plurality of tips is mounted, are divided into a plurality of divisional pads. Furthermore, each of the divisional pads are connected to each electrode terminals of those tips, and when installed, divisional pads of a pad are electrically connected to be united into a pad.

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