Multi-tiered lead package for an integrated circuit

Details Multi-tiered lead package for an integrated circuit Multi-tiered lead package for an integrated circuit

2007-04-03

2007-04-03

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257SE23024, C257SE23070

Reexamination Certificate

active

09863652

ABSTRACT:
A package for a semiconductor die comprises a semiconductor die with a bond pad. The package further includes a package lead and a bond wire with a first end portion coupled to the package lead, a second end portion coupled to the bond pad, and an intermediate portion. A non-conductive intermediate lead finger mounting substrate with an intermediate lead finger is positioned within the package. The intermediate lead finger is positioned between the lead finger and the bond pad and is attached to the intermediate portion of the bond wire.

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The American Heritage® Dictionary of the English Language, 4th edition (AHD), published by Houghton-Mifflin Company, 2000.

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