Multi-surface heat sink film

Details Multi-surface heat sink film Multi-surface heat sink film

2007-12-18

2007-12-18

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S700000, C361S719000, C165S080400, C165S104140, C165S104260, C174S015100, C174S016100, C174S016300

Reexamination Certificate

active

11307865

ABSTRACT:
An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipation.

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