Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2004-10-12
2010-06-08
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S758000, C257S777000, C257SE23141
Reexamination Certificate
active
07732904
ABSTRACT:
A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.
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Fjelstad Joseph C.
Grundy Kevin P.
Obenhuber Thomas J.
Obenhuber, legal representative Inessa
Segaram Para K.
Interconnect Portfolio LLC
Monbleau Davienne
Nguyen Dilinh P
Shea, Esq. Ronald R.
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