Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2008-08-15
2010-12-28
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S693000, C257S698000, C257S773000, C257S780000, C257S782000, C257S783000, C257S784000, C257SE25030, C257SE23020, C438S109000, C438S118000, C438S127000
Reexamination Certificate
active
07859118
ABSTRACT:
A multi-substrate region-based package and a method for fabricating the same are provided. An active surface of a chip is divided into a plurality of functional regions, and each of the functional regions is electrically connected to a corresponding substrate via bonding wires. Each of the functional regions has a separate system, and the circuit layout thereof is not limited by the substrate or other systems but can be flexibly and independently designed, thereby allowing the package to be made smaller and thinner. Each set of the functional region and its corresponding substrate functions as an independent unit, such that the substrates are not affected by each other, thereby providing good compatibility, improved reliability and reduced packaging area.
REFERENCES:
patent: 4586242 (1986-05-01), Harrison
patent: 6064219 (2000-05-01), Aigner
patent: 6288445 (2001-09-01), Kimura
patent: 2008/0164601 (2008-07-01), Lin
Clark Jasmine J
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
UTAC (Taiwan) Corporation
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