Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-01-11
2005-01-11
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S701000, C257S713000, C257S778000, C257S783000, C257S787000, C310S307000
Reexamination Certificate
active
06841418
ABSTRACT:
A microelectronic package and method for manufacture. The package can include first and second microelectronic substrates, each having a first surface with a connection site, and a second surface facing opposite the first surface. The second microelectronic substrate can be coupled to the first microelectronic substrate with the second surface of the second microelectronic substrate facing towards the first surface of the first microelectronic substrate. A conformal conductive link formed, for example, from sequentially deposited portions of conductive material, can be coupled between the first and second connection sites to provide for electrical communication between the substrates. Accordingly, the substrates can be stacked and electrically connected to reduce the footprint occupied by the substrates.
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Jeung Boon Suan
Poo Chia Yong
Waf Low Siu
Micro)n Technology, Inc.
Nelms David
Perkins Coie LLP
Tran Mai-Huong
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