Multi-substrate liquid metal high-frequency switching device

Electricity: circuit makers and breakers – Liquid contact

Reexamination Certificate

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Reexamination Certificate

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06927350

ABSTRACT:
A device and manufacturing method are provided that comprises forming first and second substrates joined together and comprising a main channel provided in at least one of the substrates and a connecting channel provided in at least one of the substrates, the connecting channel connected to the main channel, and the main channel having spaced apart electrodes and at least partially filled with liquid metal. The method further comprises forming a heater substrate comprising a suspended heater element in fluid communication with the connecting channel, the suspended heater element operable to cause a fluid non-conductor to separate the liquid metal and selectively interconnect the electrodes, and providing a high-frequency signal loss reduction structure between the main channel and the heater substrate.

REFERENCES:
patent: 6323447 (2001-11-01), Kondoh et al.
patent: 6689976 (2004-02-01), Dove et al.
patent: 6756552 (2004-06-01), Takenaka et al.
patent: 6781075 (2004-08-01), Dove et al.
patent: 6806431 (2004-10-01), Kondoh et al.
patent: 6822176 (2004-11-01), Fazzio
patent: 6841746 (2005-01-01), Wong et al.
patent: 6864767 (2005-03-01), Streeter et al.
patent: 09-161640 (1997-06-01), None
U.S. Appl. No. 10/627,308, filed Jul. 25, 2003, You Kondoh et al.
U.S. Appl. No. 10/173,383, filed Jun. 14, 2002, Marvin G. Wong et al.

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